The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “WGM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our WGM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials.
quoted priceThe requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “WGM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our WGM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials.
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Get QuoteDec 12, 2003018332A case in point is grinding a part on a Blanchard Grinder going from rough to flat and parallel. When the surface clears you make a very small adjustment on the infeed and let it quotspark outquot. This is to average out any imperfections caused by the grinding wheel or machine. This is more of a concern with solid wheels than on segment wheels.
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Get Quotesaid grinding wheel assembly including a rotatably mounted supporting shaft and a grinding wheel mounted to said supporting shaft, the surface of said holding table being adapted to have a semiconductor wafer placed thereon, and said grinding wheel being adapted to act on the surface of a wafer by rotating said grinding wheel by rotating said ...
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Get QuoteThis paper reports our recent results on the diamond grinding process of single crystallized sapphire wafers. It was found that the diamond grains were severely dislodged at the wheel workpiece interface and the material was removed by a mixed process of both grinding and lapping. Grinding governed the wafer center while lapping dominated its fringe.
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Get Quotesaid grinding wheel assembly including a rotatably mounted supporting shaft and a grinding wheel mounted to said supporting shaft, the surface of said holding table being adapted to have a semiconductor wafer placed thereon, and said grinding wheel being adapted to act on the surface of a wafer by rotating said grinding wheel by rotating said ...
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Get QuoteFIG. 1 illustrates the bumped wafer thinning process. The silicon wafer 100 has solder bumps 150 formed on a top side of the wafer and laminated to BG tape 120. The top of the wafer 100 is held to a vacuum chuck 130. Grinding wheel 140 is shown. The grinding wheel will thin the wafer …
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Get QuoteApr 01, 2001018332Fig. 2 illustrates the surface grinding process. Grinding wheels are diamond cup wheels. The workpiece wafer is held on the porous ceramic chuck by means of a vacuum. The axis of rotation for the grinding wheel is offset by a distance of the wheel radius relative to the axis of rotation of the wafer.
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